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Custom Die-Cutting Solutions for Electronic Components

As a 3M™ Preferred ISO 9001-certified die-cutter and converter, JBC Technologies provides a diverse range of custom die-cut components to solve many challenges within high-density electronics assemblies ─ from thermal management for power module baseplates to precision seals to sensor housings.

With diverse vertically integrated die-cutting equipment and years of process engineering expertise, we convert Kapton® (polyimide) films, dielectric tapes, copper foils, thermal interface materials (TIMs), custom multi-layered insulation stackups, and other flexible materials into custom assembly-ready components that provide EMI/RFI shielding, electrical insulation, thermal management, low-profile bonding, and more in dense electronics environments.

A Single U.S. Source for Assembly-Ready Electronics Parts Repeatable Solutions for Manufacturers of Connectors, Sensors, Micro-assemblies, PCBs, and More!

At JBC Technologies, we understand that electronic components are found across nearly every industry today, and many require low-profile, lightweight, automated-assembly-friendly, cost-effective die-cut components. As a vertically integrated converter, JBC helps manufacturers across industries find custom solutions to critical electronics challenges in ways that meet their budgets, manual and automated pick-and-place requirements, and timelines through:

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Automation-Ready Part Presentation

Kiss-cut rolls, pull-tabs, extended liners, discrete parts, kits, and more for manual or automated pick-and-place assembly

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Optimized High-Volume Yield

Strategic part nesting for maximum yield for expensive materials across high-volume production runs 

Semiconductor

Tight Tolerance Precision

Tight tolerance die-cutting and precision digital & laser cutting machines for highly intricate sub-assembly components 

Preventing particulate contamination for sensor optical dies and PCBAs 

In-house laminating, slitting, and surface treating for a simplified supply chain

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Bridge to Production Scalability

Rapid prototyping for quick fit, form, and function testing before scaling to high-volume rotary production

What Electronics Applications Can JBC Support?

Thermal interface materials (TIMs), EMI/RFI shielding, spacers, dielectric protection, and other die-cut applications by industry:

Whether you need protective shielding to prevent electromagnetic interference, a heat spreader to dissipate heat, or something else entirely, our strategic supplier network enables us to find materials that provide cost savings and better performance.

Industry
Applications
Materials
Look to JBC for

Satellite & Aerospace

  • Satellite power distribution modules 

  • Flight & telemetry sensors 

  • EMI micro absorbers 

  • MIL-SPEC Connectors  

  • Gap pads 

  • Electrical insulation 

  • Polyimide films (Kapton®) 

  • Low-outgassing graphite 

  • PTFE films 

  • Adhesive-backed copper tapes 

  • Conductive fabric & fluorosilicone gaskets 

  • Nickel-graphite shielding 

Agile Innovation and Rapid Prototyping Support – quickly test different materials and part designs before moving forward with full-scale production through our extensive digital cutting capabilities.  

Automotive & Electric Vehicle

  • EV battery powertrain modules 

  • High-voltage traction inverters 

  • Busbar insulation 

  • Autonomous sensors 

  • High-voltage connectors 

  • Engine control units and domain controllers 

  • HUD displays and touchscreens 

  • Flame-retardant polypropylene (Formex™ GK) 

  • Ceramic filled silicone gap pads 

  • Conductive elastomers 

  • Silicone thermal gap pads 

  • EMI absorbers 

  • Optically clear adhesives 

  • High-temperature polyimide tape (Kapton®) 

3M™ Preferred Converter Status – Access to material information and testing data, direct communication with material science experts from 3M™, and even preferential pricing on materials throughout the 3M™ ESD line.  

Battery Energy Storage (BESS)

  • Busbar insulation assemblies 

  • IGBT power modules 

  • Battery monitoring PCBAs 

  • High-voltage disconnects 

  • Silicone sponge rubbers 

  • Formex™ GK 

  • PET films 

  • Phase-change thermal interface materials 

  • Open-cell polyurethanes 

  • Ceramic fibers 

Design for Manufacturability Support – Leveraging VA/VE engineering to optimize the manufacturing efficiency of each component through strategic nesting, part presentation, and slight design tweaks for a lower total cost of production and better throughput.  

General Industrial, Semiconductor & Consumer Electronics

  • Industrial motor drives & VFDs 

  • Automation Sensors & optical filters 

  • Heavy-duty connectors 

  • PLC & Control PCBAs 

  • Data centers 

  • Smart home devices 

  • Handheld electronics 

  • PTFE films 

  • UL 94 V-0 rated polycarbonates 

  • Optically clear pressure-sensitive adhesive tapes 

  • Chemically resistant  

  • EPDM 

  • Neoprene elastomers 

  • Kapton® 

Cross-Industry Technology Transfer -  Applying lessons learned from experience across disparate industries to provide better cost savings and performance.  

Electromedical Components and Wearable Devices

  • EMI/RFI shielding in wearable devices 

  • Wearable biosensors 

  • Portable diagnostic sensors 

  • Medical device connectors 

  • Compact medical PCBAs 

  • Biocompatible medical-grade skin-contact adhesive tapes (silicone & acrylic) 

  • Microporous ePTFE 

  • Optically clear adhesives 

  • Medical-grade silicone Elastomers 

  • Kapton® 

  • Adhesive-backed copper tapes 

ISO Class 8  Cleanroom Converting – Multiple ISO Class 8 Cleanrooms and clean assembly space maintained in accordance with ISO 13485 & ISO 14644 airborne particle classification requirements and strict operations control programs (OCPs). 

Home Appliances

  • Waterproof gasketing and sealing 

  • EMI/RFI Shielding 

  • Electrical insulation 

  • Applicance control boards 

  • User interface displays & touchscreens 

  • Connectivity modules 

  • Formex™ GK 

  • Conductive gaskets 

In-Line Vertical Integration – In-line multilayer laminating, slitting, ultrasonic welding, island placement, and other capabilities for single-source efficient converting. 

JBC Technologies has strong partnerships with many leading raw material suppliers and has been recognized as an elite converter by many leading brands. 

We also work with customer supplied material. If you have material that you need converted, please reach out to your sales representative or contact us for additional information.

Ask an Engineer: Die-Cut Electronics Components FAQ

Through automation-friendly part presentation strategies like kitting, kiss-cutting, pull-tab integration, and part rotation, JBC can help set up your part for easy integration within automated or pick and place assembly.  

JBC's team of process engineering experts always look for the most efficient ways to maximize material yield, especially for expensive or "premium" materials like copper/metalized foils or Kapton® tapes. Whether it's strategically rotating and nesting parts to get the most out of a single roll of material or recommending slight design tweaks that are more efficient to manufacture, JBC strives to reduce material waste wherever possible.  

Yes, JBC's vertically integrated approach to the die-cutting process means that we can laminate multiple materials together into a single stack-up on our rotary die-cutting presses, including adhesive-backed components.  

As a 3M™ Preferred converter, we have access to innovative low-surface energy adhesives, including 3M™'s VHB™ LSE line of tapes.  

JBC provides assembly-ready die-cut solutions for a wide range of electronics applications including, connectors, sensors, PCBAs, power modules, battery management systems, wearable electronics, aerospace electronics, and more. 

JBC solves a wide range of design challegnes, including:  

  • Thermal Management - Thermal gap pads, phase change materials, Thermal interface materials (TIMs) 

  • Dielectric Protection - Kapton®, Formex™ GK, PET films, polycarbonate films 

  • EMI/RFI Shielding - Conductive fabrics, copper foils, conductive gaskets, absorber sheets 

  • Bonding & Attachment - Transfer tapes, 3M™ VHB™ tapes, thin bonding tapes, optically clear adhesive tapes 

  • Sealing & Environmental Protection - PORON®, silicone sponge rubber, EDPM, fluorosilicone 

JBC plays the important role of turning specialized flexible materials into assembly-friendly custom die-cut components that OEMs and manufacturers can use in high-performance applications. 

JBC supports clean manufacturing of sensitive electronic components through ISO Class 8 Cleanrooms and assembly space, comprehensive operational process controls, strict ISO 13485 adherence, inline quality vision systems, and more.  

Learn more about JBC's commitment to manufacturing excellence! 

Partner with JBC for Precision Converting & Assembly of Critical Electronics

JBC was founded on the three pillars of engineering innovation, manufacturing excellence, and supply chain optimization. Startups and OEMs count on JBC for innovative die-cut solutions to a wide range of electronics challenges, including EMI/RFI shielding, electrical insulation, thermal management, gasketing, bonding, joining, and more.

Through a combination of engineering acumen, ISO 13485 Certified Cleanroom converting, and extensive die-cutting capabilities, JBC provides full-production life-cycle support from prototyping to full-scale production.

Do you need die-cut electronic components? 

Submit Your Die-Cut Electronics Project Today
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