Webinar: Solve EMI/RFI Shielding & Grounding Challenges with Die-Cut Tapes
JBC Technologies is proud to co-host an EMI/RFI shielding webinar, at 2PM Thursday, May 25.
This informative webinar is designed to arm engineers with the information they can use to solve EMI shielding, grounding, and bonding challenges, fix electronic buzz, squeak, and rattle, and meet EMC design standards.
By attending you’ll gain insight on
- How to solve EMI shielding and grounding challenges without a full electrical system redesign
- How to use 3M™ Electrically Conductive Tapes for EMI shielding and grounding to minimize EMI/RFI interference
- Why conductive filler type and particle density matters.
- What’s possible using advanced die-cutting technology and converter capabilities
REGISTER HERE: https://www.globalspec.com/events/eventdetails?eventId=3334