Webinar: Solve EMI/RFI Shielding & Grounding Challenges with Die-Cut Tapes
Learn how to minimize EMI/RFI with die-cut 3M™ electrically conductive tapes
This informative webinar, which we co-hosted along with 3M is intended to arm engineers with the information they can use to solve EMI shielding, grounding, and bonding challenges, fix electronic buzz, squeak, and rattle, and meet EMC design standards.
By watching you’ll gain insight on
- How to solve EMI shielding and grounding challenges without a full electrical system redesign
- How to use 3M™ Electrically Conductive Tapes for EMI shielding and grounding to minimize EMI/RFI interference
- Why conductive filler type and particle density matters.
- What’s possible using advanced die-cutting technology and converter capabilities