Posts:

3/18/2021

Faces of JBC: Get to Know Chloe Chow

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Welcome to the March 2021 edition of “Faces of JBC”-- a series that features the folks who work day in and day out to make sure our customers receive stellar service and high-quality gaskets, seals, heat shields, acrylic foam tapes, and other custom die-cut products. Today we feature Process Engineer, Chloe Chow

Faces of JBC Team JBC
Chloe Chow - JBC Industrial Engineer
2/15/2021

Faces of JBC: Get to Know Dominic Bowlin

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Welcome to the February 2021 edition of “Faces of JBC”-- a series that features the folks who work day in and day out to make sure our customers receive stellar service and high-quality gaskets, seals, heat shields, acrylic foam tapes, and other custom die-cut products. Today we feature Process Engineer, Dominic Bowlin.

Faces of JBC Team JBC
Faces of JBC: Get to Know Dominic Bowlin
1/4/2021

TABshield™ Meets Key Ford Automotive Heat Shield Specification

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JBC Technologies has recently announced the successful completion of third-party testing of our TABshield™ thermal acoustical barrier material against Ford automotive heat shield specification: WSS-M99P32-E6. This specification is considered by many within the industry to be the gold standard for automotive heat shields. It is comprised of over 20 different tests designed to measure the minimum performance characteristics of thermal and acoustical barriers.

Announcements TABshield R&D Material Selection Heat Shielding Sound Deadening Automotive Transportation Industrial
TABshield thermal acoustic lightweight heatshield material
12/17/2020

Faces of JBC: Get to Know Carl Markel

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Welcome to the next edition of our “Faces of JBC Technologies” series where we highlight some of the people that make up our great team. This edition features our Quality Manager Carl Markel! Let's all get to know Carl a little better, shall we?

Faces of JBC Team JBC
Carl Markel  at JBC Technologies
9/22/2020

JBC White Paper Feature: Thermal Management Solutions for Electronics Applications

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Users constantly demand more from their electronic devices. Now more than ever they want smaller, sleeker, lightweight designs that are capable of processing at optimal speed. All that increased power consumption generates heat, and excess heat inhibits performance and reliability. With the demand for thermal management solutions on the rise, this paper takes a closer look at how to approach the challenge.

Material Selection R&D Electrically Conductive Tapes Adhesive Tapes Flexible Graphite Thermal Interface Materials Electronics NeoGraf 3M
JBC White Paper Feature: Thermal Management Solutions for Electronics Applications