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7/12/2018

Gap Fillers for Heat Management in Electronic Assemblies

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Gap fillers are thermal interface materials (TIMs) that move heat away from sensitive components in electronic assemblies. They’re made of silicone rubber and contain a ceramic filler. Like other types of TIMs, gap fillers are designed to fill the tiny gaps between a heat source and a heat sink.

7/5/2018

Thermal Tapes for Adhesive Bonding and Heat Conduction

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Thermal tapes are thermal interface materials (TIMs) that have an adhesive on one or both sides. Like other types of TIMs, thermally conductive tapes are designed to move heat from a heat source to a heat sink. They support die cutting and conform well to surfaces that aren’t perfectly flat.

6/28/2018

Thermal Pads and Thermal Films for Heat Dissipation

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Die cut thermal pads and thermal films dissipate heat away from hot spots in LED lighting, consumer electronics, motors, and other applications. From material selection to precision die cutting, JBC Technologies can provide the thermal interface materials (TIMs) you need.

6/20/2018

Graphite Gaskets for Thermal Management

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Graphite gaskets are die cut from thermal interface materials (TIMs) with strong thermal conductivity. They resist thermal shock and dissipate heat evenly and rapidly across printed circuit boards (PCBs). Flexible graphite sheets support die cutting, bonding to foil, and the use of PSA adhesives.

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